The power modules will be in Infineon’s HybridPack Drive G2 format (pictured) and include both silicon and silicon carbide components. Along with these, Rivian has picked infineon’s established TC3x MCUs, not not its new TC4x family – both of which have its proprietary TriCore CPUs rather than x86, Arm or RISC-V.
At the moment, Infineon only has four G2 HybridPACK Drive modules, all three-phase bridges: 750V/620A or 1.2kV/390A with SiC mosfets, or a pair of 750V/1150A Si IGBT modules.
The packages are direct-liquid-cooled, having pin-fin arrays as their thermal interface and main insulator is silicon nitride. Thermal resistance is typically 0.129°C/W to a 65°C 1litre/min 50/50 water/ethylene glycol mix. Three silicon diodes are provided for temperature monitoring.

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